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3rd International IPC/JEDEC Lead-Free Conference
By Ingrid Taylor
If you have not yet registered for admittance to the 3rd Annual International Conference on Lead-Free Electronic Components and Assemblies, jointly sponsored by IPC and JEDEC, now is the time to do so. You’ve probably been busy with little time to register. The conference is offering educational classes covering the below as well as technical presentations.
 

• Practical Guide to Lead-Free Assembly and Soldering
• Lead-Free Interconnection - Technology, Selection and Applications
• Lead-Free PCB Surface Finish and Component Coating
• Lead-Free Surface Finishes and Compatibility with Pb-Free Soldering

The Conference will be held on April 22, 2003 (Educational Courses)and April 23 - 24, 2003 (Technical Conference) at the Fairmont Hotel, www.fairmont.com,170 South Market Street, San Jose, CA., Room rates are: $149.00 single/double subject to avaiability after April 4, 2003.

The Conference will include more than 30 technical presentations ranging from lead-to-lead free product conversion concerns, Pb-Free component and board identification standard, lead-free soldering on flexible circuits and many others. A networking reception and lunches are also offered in the price of the event.

For more information regarding registrations, program, tabletop exhibits and other details, please visit our website www.pb-free.org.

 
Ingrid Taylor
ingridt@jedec.org
(The contributor)  
(Published by SMTinLine, 2003-3-23)
 
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