Soldering
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- Solder Defects Analysis and Improvement
By SMTinLine
The acceptable criterions, solder defects and reliability of BGA solder joint are discussed here. Es-pecially a disputed defect behave, void,will be analuzed detailed. Some suggestions of improving BG...
(Put date: 2007-4-9 Clicks: 3288)
- BP Microsystems Introduces 3600 ¡ª An Automated Programming System
By Tim Nolte
HOUSTON ¡ª December 9, 2003 ¡ª The 3600 incorporates BP Micro¡¯s Sixth Generation Technology for the fastest programming in the industry. The 3600 is ideal for production environments where speed and fl...
(Put date: 2003-12-11 Clicks: 3229)
- Comprehensive Guidelines for the Implementation of the AART Process
By Jay B. Hinerman
The Alternative Assembly and Reflow Technology (AART) process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. It offers several advant...
(Put date: 2000-12-9 Clicks: 3593)
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